Printed circuit boards form a major part in almost all electronic gadgets and devices. Manufacturers can be provided with drawn designs by amateur electricians and use them in manufacturing of PCB, as it is not such a difficult process after all. Multi layer, single side and double side boards are the three categories of these boards. Materials made of nickel, aluminum or copper are the ones that are used in conducting them. Density and complexity of the circuits are the determinant factors when selecting the conduction material. Here are the stages that are involved in the making of the boards.
The backing is first plated with a conductive material. Holes are then drilled into it in order for conduction to take place in between the layers and also to mount electronic components. The board is then scrubbed to get rid of any small particles of the conductor. Such particles can be later on recycled from the water by using a process such as filtration. Any copper particles left behind can easily mix with other wastes and become pollutant to the environment.
The next step is the cleaning of the board. It is also etched in order to enhance adhesion in the step that follows next. After this, another layer of conductor is added. The previously drilled holes should also be conducted and electrolysis copper plating is one of the processes that can be applied here. In order to balance the pH, it is essential to use an alkaline solution a well add some acidic solutions like copper sulfate.
The final circuit design I achieved by the use of photo imaging. Copper is electroplated to the printed circuit in order to get the final thickness. The final circuits should be well protected in the next etching and it is therefore important to apply a thin layer of lead or tin solder. The copper will be exposed by getting rid of the tin or lead solder, because it will not be a component of the final circuit. The unwanted copper is etched away using either sulfuric acid solution or an ammonia based solution.
Obtaining alternative resist can be achieved by use of other compounds that are photosensitive or organic. They can be used in their dry or wet forms. When exposed to ultraviolet light, they become hard.
A roller, squeegee, spray or silk screen can be used to apply the liquid resist. The liquid can be applied on either or both sides or just on a specific area on the surface. Light can be used in order to get better circuits.
The last stage in this process is forming multi layer panels. The layer's inner cores are assembled together. The resulting product is like a book which has a copper foil with sheets of epoxy that are alternating.
The book is then placed in a lamination press and high heat and pressure applied to it. The epoxy layers will melt and form a bond. An oven is used to cure the panel. It also undergoes trimming and buffing and then the required holes are finally drilled into it. Summarily, manufacturing of PCB requires a careful and properly calculated procedure in order to achieve the desired results.
The backing is first plated with a conductive material. Holes are then drilled into it in order for conduction to take place in between the layers and also to mount electronic components. The board is then scrubbed to get rid of any small particles of the conductor. Such particles can be later on recycled from the water by using a process such as filtration. Any copper particles left behind can easily mix with other wastes and become pollutant to the environment.
The next step is the cleaning of the board. It is also etched in order to enhance adhesion in the step that follows next. After this, another layer of conductor is added. The previously drilled holes should also be conducted and electrolysis copper plating is one of the processes that can be applied here. In order to balance the pH, it is essential to use an alkaline solution a well add some acidic solutions like copper sulfate.
The final circuit design I achieved by the use of photo imaging. Copper is electroplated to the printed circuit in order to get the final thickness. The final circuits should be well protected in the next etching and it is therefore important to apply a thin layer of lead or tin solder. The copper will be exposed by getting rid of the tin or lead solder, because it will not be a component of the final circuit. The unwanted copper is etched away using either sulfuric acid solution or an ammonia based solution.
Obtaining alternative resist can be achieved by use of other compounds that are photosensitive or organic. They can be used in their dry or wet forms. When exposed to ultraviolet light, they become hard.
A roller, squeegee, spray or silk screen can be used to apply the liquid resist. The liquid can be applied on either or both sides or just on a specific area on the surface. Light can be used in order to get better circuits.
The last stage in this process is forming multi layer panels. The layer's inner cores are assembled together. The resulting product is like a book which has a copper foil with sheets of epoxy that are alternating.
The book is then placed in a lamination press and high heat and pressure applied to it. The epoxy layers will melt and form a bond. An oven is used to cure the panel. It also undergoes trimming and buffing and then the required holes are finally drilled into it. Summarily, manufacturing of PCB requires a careful and properly calculated procedure in order to achieve the desired results.
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